The Estrada™ turnkey wafer-level reliability (WLR) test system for electromigration (EM) accelerates reliability evaluation of integrated circuit interconnect technologies
Fast results: No delays for packaging, High temperature (350°C) test capability, Automatic, camera-based realignment after TCR temperature changes
Data integrity: Oxygen-free PureZone™ nanochamber, Continuous monitoring and fast sampling, PLR correlation by using same accurate source measurement circuitry
Confidence: Comprehensive, pre-validated solutions, Fast path to first data