The APS/SPS200TESLA is the industry’s first fully-automated on-wafer probing solution focused on production performance for high-power semiconductors
Anti-arcing solution: Shielded system prevents arcing at higher voltages, protecting device and instrumentation from highvoltage discharge Anti-arcing probe, Anti-arcing probe card prevents on-wafer arcing at higher voltages by providing compressed atmosphere
MicroVac™ chuck: Uniformly distributed vacuum holes provide low contact resistance across the entire wafer, ensuring accurate measurement results, Thin-wafer handling capability enables automatic Taiko wafer loading/handling down to 50 μm thickness and conventional wafer loading/handling down to 80 μm thickness
Safety: Regulatory-certified probing environment to protect operators