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Wafer testing is the testing of individual integrated circuits at wafer level. By means of probe stations, extensive testing is done for functionality, characterization, any defective process influences or process deviations, and certain life cycle tests can also be done. The probe stations can be equipped with probe cards and/or positioners to connect the measuring points to the measuring instrumentation. In order to achieve a higher efficiency, the probe stations can also be equipped with an automatic loader, pre-aligner, Id reader, and a Foup load dock in order to be able to test 25 wafers in one batch. Testing can be done in different ways, the most common being Wafer Final Test (WFT), Electronic Die Sort (EDS) and Circuit Probe (CP). With FormFactor, Microtron has a high-quality solution for all your wafer testing. Please contact our experts for more information.